A patent by the inventors Kang, Sin-Ho (Gyeongsangbuk-do, KR); Kim, Tae-Hun (Gyeongsangbuk-do, KR); Jang, Seung-Ho (Gyeonggi-do, KR); Han, Kyoung-Bo (Gyeonggi-do, KR); Choi, Jae-yong (Gyeongsangbuk-do, KR), filed on December 20, 2010, was published online on April 29, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8709844 is assigned to LG Display Co., Ltd. (Seoul, KR).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a light emitting diode (LED) package, and more particularly, to an LED package being capable of preventing problems during a bonding process and a method of fabricating the LED package.

"Recently, LEDs are widely used because their characteristic of small size, low power consumption and high reliability. For example, LEDs are used for electric illumination and light sources in display devices. Particularly, to replace fluorescent lamps, LEDs that emits white light can be used. LEDs that emit white light are also being introduced for backlight units in liquid crystal display (LCD) devices.

"FIG. 1 is a cross-sectional view of a related art LED package. As shown in FIG. 1, the LED package 10 includes an LED chip 20 for emitting light, a case 30 as a housing, fluorescent particles 40, first and second electrode leads 50a and 50b, a heat-transfer body 60, a pair of wires 70 and a lens 80. The lens 80 covers the LED chip 20 and the fluorescent particle 40.

"The LED chip 20 is disposed on the heat-transfer body 60. The heat-transfer body 60 has a space. The space of the heat-transfer body 60 is covered with the case 30 and is packed with the fluorescent particles 40. The first and second electrode leads 50a and 50b are disposed through the heat-transfer body 60, and one end of each of the first and second electrode leads 50a and 50b protrudes from the case 30 to be electrically connected to an exterior current supplying unit (not shown) to receive a driving current for the LED chip 20. The other end of each of the first and second electrode leads 50a and 50b is respectively electrically connected to the LED chip 20 through the wires 70. The lens 80 covers the LED chip 20, the fluorescent particles 40, the heat-transfer body 60 and the wires 70, and controls an angle of light from the LED chip 20.

"When the driving current is applied to the LED chip 20, the LED chip 20 emits light. The light from the LED chip 20 mixes with light from the fluorescent particles 40 to produce white light. Thus, white light is emitted through the lens 80.

"The LED package 10 requires the wires 70 to provide the driving current from the exterior current supplying unit to the LED chip 20. Unfortunately, there can be an open defect on the wires 70. In addition, since the wires 70 are positioned at a path of the light from the LED chip 20, luminescent efficiency of the LED package 10 is decreased. Furthermore, a bonding process, for example, a soldering process, is required for connecting the wires 70 to the LED chip 20. The bonding process is very complicated such that processing yield is also decreased."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "Accordingly, the present invention is directed to an LED package and a method of fabricating the LED package that substantially obviate one or more of the problems due to limitations and disadvantages of the related art.

"An object of the present invention is to improve lamination efficiency of an LED package.

"Another object of the present invention is to prevent problems during a bonding process for an LED package.

"To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a light emitting diode (LED) package comprises a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

"In another aspect, a method of fabricating a light emitting diode (LED) package comprises forming a case having first and second lead frames on a surface thereof; forming a LED chip having a transparent substrate, a LED structure, a first electrode and a second electrode; positioning the LED chip on the case such that the first and second electrodes directly contact the first and second lead frames; irradiating electromagnetic radiation onto the contact portion between the first electrode and the first lead frame as well as the second electrode and the second lead frame to generate eutectic bonding.

"Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed."